Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
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United States of America Patent
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-
Dec 23, 2003
Issued Date -
N/A
app pub date -
Oct 6, 2001
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a conductive trace and an insulative base, wherein the chip includes a conductive pad, the conductive trace includes a bumped terminal, the bumped terminal includes a cavity that extends through the insulative base, and the insulative base contacts the conductive trace on a side opposite the chip, then forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad, and then forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, an insulative adhesive that attaches the chip to the conductive trace or an encapsulant that encapsulates the chip fills the cavity and provides compressible mechanical support for the bumped terminal.
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