Integrated circuit package including opening exposing portion of an IC
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 23, 2003
Grant Date -
Jul 11, 2002
app pub date -
Aug 16, 2001
filing date -
Aug 17, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the exposed portion of the IC and spaced inwardly from a periphery of the opening based upon molding using a mold protrusion which includes a bleed-through retention channel positioned inwardly from peripheral edges. The channel collects and retains any bleed-through of the encapsulating material. The IC package may further include a leadframe carrying the IC. The leadframe may include a die pad, finger portions, and a plurality of die pad support bars. The die pad may be downset below a level of the finger portions. Each of the die pad support bars may be resiliently deformed to accommodate the downset of the die pad. Low stress encapsulating material and adhesive may also be included in the IC package.
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