Diamond heat spreading and cooling technique for integrated circuits
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United States of America Patent
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Dec 23, 2003
Grant Date -
Oct 10, 2002
app pub date -
Apr 6, 2001
filing date -
Apr 6, 2001
priority date (Note) -
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Abstract
A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.
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