Method of forming a dielectric film

United States of America Patent

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Dec 30, 2003
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Apr 11, 2002
app pub date
May 31, 2001
filing date
Mar 13, 2000

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Abstract

A method of forming an insulation film includes the steps of forming an insulation film on a substrate, and modifying a film quality of the insulation film by exposing the insulation film to atomic state oxygen O* or atomic state hydrogen nitride radicals NH* formed with plasma that uses Kr or Ar as inert gas.

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FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE	586-9 USHIGAFUCHI AKATSUKA TSUKUBA-CITY IBARAKI PREFECTURE 305-0062

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Inventor Name	Address	# of filed Patents	Total Citations
Ohmi, Tadahiro	1-17-301, Komegafukuro 2-Chome, Aoba-Ku, Sendai-Shi, Miyagi 980-0813, JP	798	14083
Sugawa, Shigetoshi	Sendai, JP	207	5471

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Method of forming a dielectric film

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United States of America Patent

09867767

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PATENT NO	6669825
APP PUB NO	20020040847A1
SERIAL NO	09867767
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 30, 2003	US,6669825,B2 US6669825B2	GRANTED PATENT AS SECOND PUBLICATION
April 11, 2002	US,20020040847,A1 US20020040847A1	FIRST PUBLISHED PATENT APPLICATION

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09867767

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