US Patent No: 6,670,212
Number of patents in Portfolio can not be more than 2000
Micro-machining
Stats
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Dec 30, 2003
Issued date -
Jul 5, 2001
filing date -
09/898,081
serial no -
In Force
status
Importance
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Abstract
A method of fabricating a micro-mechanical sensor (101) comprising the steps for forming an insulating layer (6) onto the surface of a first wafer (4) bonding a second wafer (2) to the insulating layer (6), patterning and subsequently etching either the first (4) or second wafer (6) such that channels (18,20) are created in either the first (2) or second (4) wafer terminating adjacent the insulating layer (6) and etching the insulating layer (6) to remove portions of the insulating layer (6) below the etched wafer such that those portions of the etched wafer below a predetermined cross section, suspended portions (22), become substantially freely suspended above the un-etched wafer. This method uses Silicon on Insulator technology. Also disclosed is a micro-mechanical gyroscope structure (101) allowing an anisotropic silicon to be used to fabricate a sensor functioning as if fabricated from isotropic silicon.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,238,223 Method of making a microvalve | 69 | 1992 | |
| 5,616,523 Method of manufacturing sensor | 39 | 1996 | |
| 5,756,901 Sensor and method for manufacturing a sensor | 46 | 1996 | |
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| 4,968,628 Method of fabricating back diffused bonded oxide substrates | 25 | 1988 | |
| 5,656,512 Method of manufacturing a semiconductor accelerometer | 11 | 1995 | |
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| 5,415,726 Method of making a bridge-supported accelerometer structure | 10 | 1993 | |
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| 6,048,774 Method of manufacturing dynamic amount semiconductor sensor | 19 | 1998 | |
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| 5,324,683 Method of forming a semiconductor structure having an air region | 399 | 1993 | |
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| 5,511,428 Backside contact of sensor microstructures | 95 | 1994 | |
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| 5,864,064 Acceleration sensor having coaxially-arranged fixed electrode and movable electrode | 18 | 1996 | |
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| 5,682,053 Silicon transducer with composite beam | 15 | 1996 | |
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| 6,159,385 Process for manufacture of micro electromechanical devices having high electrical isolation | 44 | 1998 | |
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| 6,122,090 Method of micromachining a scanning torsion mirror | 14 | 1999 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 30, 2015 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |