Semiconductor module and electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 30, 2003
Grant Date -
Aug 1, 2002
app pub date -
Dec 4, 2001
filing date -
Feb 1, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.
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