Substrate processing apparatus
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United States of America Patent
Stats
-
Jan 6, 2004
Grant Date -
Jun 5, 2003
app pub date -
Jan 16, 2003
filing date -
Oct 19, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A spin chuck for holding a wafer to the front face of which a resist solution is supplied, a cup for housing the spin chuck and forcibly exhausting an atmosphere around the wafer by exhaust from the bottom thereof, and an air flow control plate, provided in the cup to surround the outer periphery of the wafer, for controlling an air flow in the vicinity of the wafer are provided. Accordingly, a state of special air flow at an outer edge portion of a substrate to be processed can be eliminated, thereby preventing an increase in film thickness at the outer edge portion.
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