Wafer-interposer using a ceramic substrate
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United States of America Patent
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-
Jan 6, 2004
Grant Date -
Aug 29, 2002
app pub date -
Feb 23, 2001
filing date -
Feb 23, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method and apparatus for testing semiconductor wafers that is simple and allows testing prior to dicing so that the need to temporarily package individual dies for testing is eliminated. As a result, the number of manufacturing steps is reduced, thus increasing first pass yields. In addition, manufacturing time is decreased, thereby improving cycle times and avoiding additional costs. After testing, the wafer is diced into the individual circuits, eliminating the need for additional packaging. One form of the present invention provides an interposer substrate made of a ceramic material that has an upper and a lower surface. There are one or more first electrical contacts on the lower surface and one or more second electrical contacts on the upper surface. There are also one or more electrical pathways that connect the first and second electrical contacts.
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