Method of connecting a conductive trace and an insulative base to a semiconductor chip
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United States of America Patent
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Jan 6, 2004
Issued Date -
N/A
app pub date -
Sep 24, 2001
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a conductive trace and an insulative base, wherein the chip includes a conductive pad and the insulative base contacts the conductive trace on a side opposite the chip, then forming a through-hole that extends through the insulative base and exposes the conductive trace and the pad, and then forming a connection joint that contacts and electrically connects the conductive trace and the pad.
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