Multiple row fine pitch leadless leadframe package with use of half-etch process
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United States of America Patent
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-
Jan 6, 2004
Grant Date -
N/A
app pub date -
Feb 9, 2001
filing date -
Feb 9, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadless leadframe panel comprising a partially etched top surface of a substrate panel that forms recessed regions that define a portion of a first and a second set of tie bars and a portion of a first and second set of contact pads. A bottom surface of the panel forms lower recessed regions that define the remaining portion of the first and second set of tie bars and the remaining portion of the first and second set of contact pads. The resulting contact pads are connected to a respective one of the tie bars.
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Family
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