Vapor phase connection techniques
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United States of America Patent
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Jan 13, 2004
Grant Date -
N/A
app pub date -
Aug 11, 2000
filing date -
Aug 11, 1999
priority date (Note) -
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Abstract
Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.
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