Integrated injection forming shoe midsole having a dual-layer pad

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United States of America Patent

PATENT NO 6675502
SERIAL NO

10086241

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Abstract

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An integrated injection forming shoe midsole having a dual-layer pad includes a midsole and a dual-layer pad integrally formed by an injection forming process to form a tightly bonding between the midsole and the dual-layer pad. The dual-layer pad has a softer pliable pad on the upper layer and a harder and resilient cushion pad on the lower layer, and a buffer section corresponding to the heel location. Through the buffer section and the upper and lower-layers which have different material properties, the midsole may provide wearers more comfortable feeling and shock-absorbing bouncing resilience when touching ground surface.

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Patent Owner(s)

Patent OwnerAddress
CHEN SUNG-HONot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Sung-Ho No. 52-1, Pu-Tsei Rd., Pu-Nan Tsun, Pu-Yen Hsiang, Chang-Hua Hsien, TW 6 66

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