Importance

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Abstract

An in-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material, for example. The actuator includes first and second anchors secured to the substrate and a floating center beam positioned between the first and second anchors and movable relative to the substrate. Symmetric first and second sets of elongated thermal half-beams are secured between opposite sides of the floating center beam and the respective first and second anchors. The half-beams are formed of semiconductor material, such as polysilicon. A current source directs electrical current through the thermal half beams via the anchors to impart thermal expansion of the thermal half-beams and hence linear motion of the floating center beam generally parallel to the substrate. In one implementation, the half-beams are configured at a bias angle to give the floating beam an affinity for in-plane motion. An actuator of the present invention with such bias angles can give the actuator an overall chevron configuration.

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First Claim