Methods and compositions for chemical mechanical polishing
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United States of America Patent
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Jan 13, 2004
Grant Date -
Feb 27, 2003
app pub date -
Aug 24, 2001
filing date -
Aug 24, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and apparatus are provided for planarizing substrate surfaces with selective removal rates and low dishing. One aspect of the method provides for processing a substrate including providing a substrate to a polishing platen having polishing media disposed thereon, providing an abrasive free polishing composition comprising one or more surfactants to the substrate surface to modify the removal rates of the at least the first dielectric material and the second dielectric material, polishing the substrate surface, and removing the second material at a higher removal rate than the first material from a substrate surface. One aspect of the apparatus provides a system for processing substrates including a platen adapted for polishing the substrate with polishing media and a computer based controller configured to perform one aspect of the method.
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