Configuration for testing a substrate mounted with a most performance-demanding integrated circuit
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United States of America Patent
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Jan 13, 2004
Issued Date -
N/A
app pub date -
Nov 28, 2000
filing date -
Jan 13, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention discloses a method for mounting multiple integrated circuit (IC) chips on a top surface of a substrate. The method includes a step forming a first footprint to include a plurality of electrical contacts on the top surface for mounting a first IC chip thereon. The method further includes a step of forming a set of substrate testing footprints to include a plurality of package mounting and testing electrical contacts for temporarily mounting a plurality of testing packages to conduct a functional MCM test. The functional MCM test is to test the substrate mounted with the first IC chip and the testing packages.
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