Structure and method of forming a multiple leadframe semiconductor device
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United States of America Patent
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Jan 13, 2004
Grant Date -
Nov 13, 2003
app pub date -
Apr 26, 2002
filing date -
Apr 26, 2002
priority date (Note) -
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Abstract
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
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