Methods and apparatus for surface analysis
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United States of America Patent
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Jan 13, 2004
Grant Date -
N/A
app pub date -
Oct 31, 2000
filing date -
Oct 31, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is described method and apparatus to create multi-dimensional non-spatial histograms of surfaces and to compare such histograms to show whether the surfaces substantially conform to one another. This analysis is particularly applicable to comparing die on wafers to determine whether manufactured devices conform to a master or whether one die is like another.
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