Method of calibrating a wafer edge gripping end effector
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United States of America Patent
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Jan 13, 2004
Grant Date -
Jul 17, 2003
app pub date -
Jan 14, 2002
filing date -
Jan 14, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method of calibrating a wafer edge gripping end effector. A wafer calibration tool is held in a stationary position simulating the position of a semiconductor wafer to be picked up by the wafer edge gripping end effector. A controller associated with a robot having an end effector attached to a robot arm thereto is turned off. The robot arm and end effector are moved to position where the first and second clamp structures on the end effector each engage a respective inner edge that in part defines a notch formed in the wafer calibration tool. An actuator driven movable clamp structure is manually advanced so that the movable clamp structure engages an inner edge that in part defines one of the notches formed in the wafer calibration tool. The controller is turned on and data regarding the location of robot arm, end effector and movable clamp structure is stored.
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