Surface deformation of carrier for printhead dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 20, 2004
Grant Date -
May 1, 2003
app pub date -
Oct 25, 2001
filing date -
Oct 25, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.
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