Polishing composition and polishing method employing it

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United States of America Patent

PATENT NO 6679929
APP PUB NO 20020139055A1
SERIAL NO

10046394

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Abstract

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A polishing composition comprising the following components (a) to (g): (a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide, (b) an aliphatic carboxylic acid, (c) at least one basic compound selected from the group consisting of an ammonium salt, an alkali metal salt, an alkaline earth metal salt, an organic amine compound and a quaternary ammonium salt, (d) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, .alpha.-alanine and histidine, (e) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (f) hydrogen peroxide, and (g) water.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 4528502 ?4528502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asano, Hiroshi Aichi, JP 131 976
Ina, Katsuyoshi Aichi, JP 17 529
Sakai, Kenji Aichi, JP 126 1404

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