Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 20, 2004
Grant Date -
Feb 7, 2002
app pub date -
Dec 14, 2000
filing date -
Jul 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfaces of each chip bonded to the first wafer sheet are covered with a reinforcing thin film. Each of the plurality of chips is removed from the first wafer sheet. The flexural strength of a chip can be suppressed from being lowered by chipping and chip cracks.
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