Laser marking techniques for bare semiconductor die
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United States of America Patent
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Jan 20, 2004
Issued Date -
N/A
app pub date -
Aug 30, 2001
filing date -
Feb 26, 1999
priority date (Note) -
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Abstract
A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described herein.
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