Semiconductor device for suppressing detachment of conductive layer
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United States of America Patent
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Jan 20, 2004
Grant Date -
Apr 11, 2002
app pub date -
Feb 22, 2001
filing date -
Oct 10, 2000
priority date (Note) -
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Abstract
A semiconductor device and a method for manufacturing the semiconductor device are provided in which a lower plug electrically connected with an active region of a wafer has a recession, and a conductive layer has a projection fitted into the recession of the lower plug, so that a contact area between the lower plug and the conductive layer increases without increasing a contact resistance therebetween. Thus, the conductive layer can endure physical impacts applied in the formation of the conductive layer itself and in subsequent integration processes, without detaching from the lower plug or the wafer.
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