Polishing apparatus having a dresser and dresser adjusting method
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United States of America Patent
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-
Jan 27, 2004
Grant Date -
Sep 19, 2002
app pub date -
Jul 18, 2001
filing date -
Mar 15, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The polishing particle surface of the dresser of a chemical mechanical polishing apparatus used for a planarization process in manufacturing semiconductor devices is inclined. Moreover, the pressure to be applied onto the polishing surface of the dresser is linearly varied with a nonzero slope.
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