Shield cap and semiconductor package including shield cap
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United States of America Patent
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Jan 27, 2004
Grant Date -
N/A
app pub date -
Apr 10, 2002
filing date -
Apr 10, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive components without encapsulating the passive components within the encapsulation protecting the semiconductor die. The shield cap provides electromagnetic shielding and physical protection for the passive components and may provide thermal conduction from a semiconductor die by contacting the semiconductor die. The shield cap may be perforated to permit air circulation through the shield cap for providing improved thermal performance or may be a solid metal shield, providing improved electromagnetic shielding.
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