Method of making an integrated circuit package
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United States of America Patent
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Feb 3, 2004
Issued Date -
N/A
app pub date -
Oct 22, 2001
filing date -
Jun 24, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
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