Temperature regulator for a substrate in vapor deposition processes
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United States of America Patent
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Feb 3, 2004
Grant Date -
N/A
app pub date -
Nov 17, 2000
filing date -
Nov 19, 1999
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Abstract
A heat transfer regulating mixture having a metallic component A with a melting point T.sub.A and a particulate ceramic component B which is non-wettable by the metallic component A, non-reactive therewith and which has a melting temperature T.sub.B which is higher than both the temperature T.sub.A and a desired operating temperature T.sub.D which is also higher than T.sub.A. The metallic component A and the particulate ceramic component B and the respective amounts will typically be selected to have a higher thermal resistivity above T.sub.A than below T.sub.A. The heat transfer regulating mixture may be incorporated in the heat transfer regulating device having the mixture within an enclosure having first and second contact faces.
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