Transferable resilient element for packaging of a semiconductor chip and method therefor
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United States of America Patent
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Feb 3, 2004
Grant Date -
Jan 24, 2002
app pub date -
Jun 20, 2001
filing date -
Dec 13, 1996
priority date (Note) -
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Abstract
A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the the first liner. The plurality of resilient elements adhere to the tacky material so that upon removal of the plurality of resilient elements from the liner, the tacky material will adhere to the plurality of resilient elements and provide a tacky surface thereon.
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