US Patent No: 6,686,588

Number of patents in Portfolio can not be more than 2000

Optical module with lens integral holder

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface of the substrate thus mounting the lens housing to the sidewall. To minimize the overall width of the optical module and to maximize the strength of the bond between the lens housing and the substrate, the mounting surface of the lens housing is formed with a locking feature. The locking feature includes a horizontal surface bonded to the joint surface and a vertical surface bonded to an interior surface of the sidewall.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AMKOR TECHNOLOGY, INC.CHANDLER, AZ734

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glenn, Thomas P Gilbert, AZ 136 4916
Hollaway, Roy Dale Chandler, AZ 37 809
Webster, Steven Chandler, AZ 125 2381

Cited Art

Patent Info (Count) # Cites Year
 
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6,396,116 Integrated circuit packaging for optical sensor devices 79 2000
 
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4,390,220 Electrical connector assembly for an integrated circuit package 79 1981

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (38)
7,274,094 Leadless packaging for image sensor devices 9 2002
7,112,471 Leadless packaging for image sensor devices and methods of assembly 15 2003
7,498,647 Packaged microelectronic imagers and methods of packaging microelectronic imagers 11 2004
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7,402,453 Microelectronic imaging units and methods of manufacturing microelectronic imaging units 1 2004
7,364,934 Microelectronic imaging units and methods of manufacturing microelectronic imaging units 3 2004
7,429,494 Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers 2 2004
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7,271,482 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 36 2004
7,795,134 Conductive interconnect structures and formation methods using supercritical fluids 1 2005
7,646,075 Microelectronic imagers having front side contacts 1 2005
7,321,455 Microelectronic devices and methods for packaging microelectronic devices 8 2005
7,511,262 Optical device and assembly for use with imaging dies, and wafer-label imager assembly 0 2005
7,622,377 Microfeature workpiece substrates having through-substrate vias, and associated methods of formation 4 2005
7,262,134 Microfeature workpieces and methods for forming interconnects in microfeature workpieces 29 2005
7,253,390 Methods for packaging microelectronic imagers 2 2006
7,341,881 Methods of packaging and testing microelectronic imaging devices 6 2006
7,329,943 Microelectronic devices and methods for forming interconnects in microelectronic devices 1 2006
7,589,008 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods 7 2006
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7,439,598 Microelectronic imaging units 0 2006
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7,417,294 Microelectronic imaging units and methods of manufacturing microelectronic imaging units 0 2007
7,915,736 Microfeature workpieces and methods for forming interconnects in microfeature workpieces 0 2007
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7,531,453 Microelectronic devices and methods for forming interconnects in microelectronic devices 4 2008
7,655,507 Microelectronic imaging units and methods of manufacturing microelectronic imaging units 1 2008
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7,842,915 Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers 0 2009
7,956,443 Through-wafer interconnects for photoimager and memory wafers 1 2010
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APTINA IMAGING CORPORATION (24)
7,583,862 Packaged microelectronic imagers and methods of packaging microelectronic imagers 1 2003
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7,115,961 Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices 11 2004
7,276,393 Microelectronic imaging units and methods of manufacturing microelectronic imaging units 10 2004
7,303,931 Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces 0 2005
7,190,039 Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers 11 2005
7,288,757 Microelectronic imaging devices and associated methods for attaching transmissive elements 10 2005
7,511,374 Microelectronic imaging units having covered image sensors 0 2006
7,723,741 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 1 2006
7,696,588 Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers 1 2007
7,504,615 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 0 2007
7,691,660 Methods of manufacturing microelectronic imaging units on a microfeature workpiece 0 2007
7,663,096 Microelectronic imaging devices and associated methods for attaching transmissive elements 1 2007
7,795,649 Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces 0 2007
7,786,574 Microelectronic imaging units 1 2009
7,709,776 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 0 2009
 
AMKOR TECHNOLOGY, INC. (7)
7,576,401 Direct glass attached on die optical module 2 2005
7,425,750 Snap lid camera module 2 2005
7,609,461 Optical module having cavity substrate 2 2005
7,199,359 Camera module fabrication method including singulating a substrate 13 2006
7,332,712 Camera module fabrication method including the step of removing a lens mount and window from the mold 3 2007
7,786,429 Camera module with window mechanical attachment 0 2008
7,911,017 Direct glass attached on die optical module 0 2009
 
CYPRESS SEMICONDUCTOR CORPORATION (4)
7,129,722 Methods of improving reliability of an electro-optical module 5 2002
6,892,449 Method of manufacturing electro-optical devices 7 2002
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ROUND ROCK RESEARCH, LLC (3)
7,294,897 Packaged microelectronic imagers and methods of packaging microelectronic imagers 4 2004
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DIGITAL OPTICS CORPORATION (2)
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HON HAI PRECISION INDUSTRY CO., LTD. (2)
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ADVANCED CHIP ENGINEERING TECHNOLOGY INC. (1)
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ATMEL GRENOBLE S.A. (1)
7,626,239 Process for the collective fabrication of optical filtering components, and wafer of components 0 2003
 
AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. (1)
7,065,113 Method and apparatus for interconnecting a laser array and an integrated circuit of a laser-based transmitter 0 2002
 
CANON KABUSHIKI KAISHA (1)
7,443,444 Image pickup apparatus 0 2004
 
DIGITAL IMAGING SYSTEMS GMBH (1)
7,405,764 Miniature camera module 6 2003
 
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (1)
7,379,149 Low temperature active matrix display device and method of fabricating the same 0 2005
 
FLEXTRONICS AP, LLC (1)
8,092,102 Camera module with premolded lens housing and method of manufacture 1 2006
 
HAMAMATSU PHOTONICS K.K. (1)
7,964,898 Back illuminated photodetector 0 2009
 
KABUSHIKI KAISHA TOSHIBA (1)
8,045,026 Solid-state image sensing device 1 2008
 
KINGPAK TECHNOLOGY INC. (1)
7,368,795 Image sensor module with passive component 0 2005
 
LEXMARK INTERNATIONAL, INC. (1)
8,319,813 Mounting assembly for reflection mirror in laser scanning unit 0 2009
 
OPTICAL COMMUNICATION PRODUCTS, INC. (1)
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QINETIQ LIMITED (1)
7,348,203 Hermetic packaging 2 2003
 
SIGURD MICROELECTRONICS CORP. (1)
7,358,482 Packaging structure of a light-sensing element and fabrication method thereof 0 2005
 
STMICROELECTRONICS PVT. LTD. (1)
7,834,311 Lens assembly with a rotatable adjustable member for discretely varying position of a mounting member 0 2007
 
SUNPOWER CORPORATION (1)
7,397,066 Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers 0 2004
 
TEXAS INSTRUMENTS INCORPORATED (1)
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YOULIZA, GEHTS B.V. LIMITED LIABILITY COMPANY (1)
8,068,182 Multiple frame grabber 0 2009

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 3, 2015
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00