Interposer for improved handling of semiconductor wafers and method of use of same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 3, 2004
Grant Date -
N/A
app pub date -
Nov 7, 2000
filing date -
Nov 7, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus (10) for reducing the likelihood of damaging a semiconductor wafer (18) and the integrated circuit chips of the semiconductor wafer (18) during handling is disclosed. The apparatus (10) comprises a wafer interposer (12) having a wafer receiving portion (28) and a handling portion (30). The wafer receiving portion (28) of the wafer interposer (12) has a plurality of contact pads (22) that are electrically connected and mechanically bonded to the contact pads of the integrated circuit chips of the wafer (18). The handling portion (30) of the wafer interposer (12) extends outwardly from the wafer receiving portion (28) such that the handling portion (30) is accessible to handling equipment without the handling equipment contacting the attached wafer (18).
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