Importance

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Abstract

In evaluation and analysis of a semiconductor device using optical detection for a semiconductor chip, both front side analysis and back side analysis are enabled at low cost and a short TAT. A prober for conducting the analysis includes a board having a size equal to the size of a semiconductor wafer, a quartz plate provided in an opening of the board, and a manipulator on the board. The semiconductor chip is pushed and fixed onto a quartz plate using the pressure from a probe. During the front side analysis, the prober for conducting the analysis is mounted on a wafer stage and analysis is performed using an optical device while an electrical input is made through the probe. During the back side analysis, a removable plate is attached and the prober for conducting the analysis is turned upside down and mounted on the wafer stage. The analysis is again performed using the optical device while electrical input is made through the probe.

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First Claim