Surface mountable laminated circuit protection device and method of making the same
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United States of America Patent
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Feb 3, 2004
Grant Date -
Oct 3, 2002
app pub date -
Mar 13, 2002
filing date -
Mar 28, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.
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