Parallel plate development with multiple holes in top plate for control of developer flow and pressure
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United States of America Patent
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Feb 10, 2004
Grant Date -
N/A
app pub date -
Oct 10, 2001
filing date -
Oct 25, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.
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