Conductive plastic compositions and method of manufacture thereof
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United States of America Patent
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Feb 10, 2004
Grant Date -
Dec 5, 2002
app pub date -
Nov 15, 2001
filing date -
Apr 27, 2001
priority date (Note) -
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Abstract
An improved, conductive, polymeric composition comprises a polymeric resin; an electrically conductive filler system comprising small carbon fibers and either carbon powder or fibrous non-conductive filler or a combination of both. The amount of the conductive filler system utilized is dependent upon the desired electrical conductivity (surface and volume conductivity or resistivity) while preferably preserving intrinsic properties of the polymeric resin such as impact, flex modulus, class A finish, and the like. The conductive articles made from these compositions can therefore be used for electromagnetic shielding, electrostatic dissipation or antistatic purposes in packaging, electronic components, housings for electronic components and automotive housings.
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