Semiconductor device having reliable coupling with mounting substrate
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United States of America Patent
Stats
-
Feb 10, 2004
Grant Date -
Aug 1, 2002
app pub date -
Jan 28, 2002
filing date -
Jan 26, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A downsized semiconductor device comprises a plurality of bonding pads formed on a surface of a semiconductor chip. A plurality of conductive wires are coupled to the bonding pad and extends away from the surface of the semiconductor chip. The surface of the semiconductor chip and the periphery of the plurality of conductive wires are covered with a resin layer. Each of the conductive wires and the resin layer covering the periphery of the conductive wire forms a coaxial body. A plurality of solder balls are mounted on the top end portion of the coaxial bodies and are electrically coupled with the conductive wires. Reinforcement resin portions are provided each of which is attached to an area from an upper end portion of the coaxial body to the solder ball to reinforce the coupling of the solder ball with the coaxial body.
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