RF circuit assembly
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United States of America Patent
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-
Feb 10, 2004
Grant Date -
May 22, 2003
app pub date -
Nov 19, 2001
filing date -
Nov 19, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.
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