High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus
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United States of America Patent
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Feb 17, 2004
Grant Date -
Sep 25, 2003
app pub date -
Mar 4, 2003
filing date -
Mar 25, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Liquid for prevention of substrate drying is supplied into a processing chamber so that a pool of the liquid is created as an anti-drying atmosphere in advance inside a processing chamber, and substrates, as they are dipped in the pool, are kept on stand-by in a substrate board. In this manner, air drying of the substrates which are kept on stand-by is prevented. When the number of the substrates in the substrate board reaches a certain number, the anti-drying atmosphere is removed from the processing chamber, which is followed by introduction of an SCF into the processing chamber and supercritical drying (high pressure drying) of all of the plurality of substrates inside the processing chamber, namely, batch supercritical drying.
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