Substrate processing apparatus
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United States of America Patent
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-
Feb 17, 2004
Grant Date -
Sep 5, 2002
app pub date -
Feb 28, 2002
filing date -
Mar 1, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A developer is supplied onto a substrate and thereafter a rinse discharge nozzle is moved toward an operating direction. The rinse discharge nozzle is so moved on the substrate as to continuously supply pure water onto the substrate from a slit discharge port of the rinse discharge nozzle while sucking and recovering the pure water from the surface of the substrate through a slit suction port, and a series of development is performed in a stationary state of the substrate.
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