Deadhesion method and mechanism for wafer processing
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United States of America Patent
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Feb 17, 2004
Grant Date -
Jan 9, 2003
app pub date -
Aug 27, 2002
filing date -
May 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed flexible planar interface material contacting the deformable material.
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