Optical integrated circuit element package and process for making the same
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United States of America Patent
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Feb 17, 2004
Grant Date -
Dec 25, 2003
app pub date -
Jan 31, 2003
filing date -
Jun 20, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An optical integrated circuit element package comprises a substrate, an upper chip, a lower chip, an optical-transparent underfill, and a sealing compound. The substrate has a plurality of solder balls disposed on a surface of the substrate, a plurality of bonding pads electrically connected to the solder balls, a cover attached to the other surface of the substrate, and a cavity to expose the cover. The upper chip is provided with a plurality of bumps and is adhered to the exposed cover in the cavity by a thermal gap fill. The lower chip has a plurality of bonding pads electrically connected to the plurality of bumps of the upper chip and has a plurality of bumps electrically connected to the plurality of bonding pads of the substrate. The optical-transparent underfill is disposed between the lower chip and the upper chip. The sealing compound hermetically seals the space between the lower chip and the substrate.
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