Snap with supports

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6694573
APP PUB NO 20010034927A1
SERIAL NO

09840112

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This invention intends to provide a snap with supports, the snap being formed of resin across a pair of tapes in a simple manner thereby leading to improvement of productivity and securing a solid structure and practical performance. Supports such as tapes are disposed in parallel with a gap. By using this gap, male bodies or female bodies of the snaps of thermoplastic resin are formed across opposing edges of the tapes opposing each other at a predetermined pitch by injection molding means or extrusion molding means. A string may be used as the support. Different from a conventional processing in which an attaching hole is made in the center of the tape and resin snap is formed therein, a boring step is not necessary. Thus, this snap with tapes is created through such a simple processing.

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Patent Owner(s)

Patent OwnerAddress
YKK CORPORATION1 KANDA IZUMI-CHO CHIYODA-KU TOKYO 1018642

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsushima, Hideyuki Toyama-ken, JP 36 469

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