Method of attaching semiconductor devices on a switching device and such an attached device
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United States of America Patent
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Feb 24, 2004
Grant Date -
May 8, 2003
app pub date -
Sep 16, 2002
filing date -
Sep 14, 2001
priority date (Note) -
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Abstract
A method of attaching semiconductor devices, the contact devices of which have preferably already been applied at wafer level, on a switching device and such a device includes having the electrical contacts remain free of solder by using flexible contact elements, and performing the mechanical attachment by additional attachment elements or compression stops used as attachment elements.
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