On-wafer packaging for RF-MEMS
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United States of America Patent
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-
Feb 24, 2004
Grant Date -
Nov 13, 2003
app pub date -
May 8, 2002
filing date -
May 8, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first silicon wafer. A micro-electro-mechanical device is provided and coupled to the top surface of the first silicon wafer. An electrical feed line then extends along the bottom surface of the first silicon wafer and an electrical interconnect electrically couples the micro-electro-mechanical device and the electrical feed line through the bore.
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