Encapsulated semiconductor device with flash-proof structure
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United States of America Patent
Stats
-
Feb 24, 2004
Grant Date -
Nov 22, 2001
app pub date -
May 22, 2001
filing date -
May 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a bottom surface of the lead frame, where the dam bar is attached to both the lead frame and the tape. The semiconductor device further includes an encapsulation body having a core-hollowed portion integrated with the lead frame, the core-hollowed portion being bordered by the dam bar and the tape so that a semiconductor chip and conductive elements are exposed in the encapsulation body. A lid can be adhered to the encapsulation body to air-tightly seal the semiconductor chip and encapsulation elements in the core-hollowed portion.
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