Devices and methods for mounting components of electronic circuitry
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United States of America Patent
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Mar 2, 2004
Grant Date -
N/A
app pub date -
Mar 27, 2002
filing date -
Mar 27, 2002
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Abstract
Devices and methods for mounting components of electronic circuitry and these mounting devices are capable of surviving repeated thermal cycling. The devices comprise two metal laminate members brazed to a ceramic member on each of the two major surfaces of the ceramic member. The laminates preferably comprise a layer of molybdenum disposed between two layers of copper. The thickness of the individual layers comprising the metal laminate member may be varied to yield a laminate CTE similar to the CTE of the ceramic member to be joined.
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