Electrical connection with inwardly deformable contacts
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United States of America Patent
Stats
-
Mar 2, 2004
Grant Date -
Aug 9, 2001
app pub date -
Feb 8, 2001
filing date -
Dec 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.
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