Modular semiconductor die package and method of manufacturing thereof
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United States of America Patent
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-
Mar 2, 2004
Grant Date -
Aug 28, 2003
app pub date -
Feb 25, 2002
filing date -
Feb 25, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.
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