Circuit board with integrated circuit
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United States of America Patent
Stats
-
Mar 2, 2004
Grant Date -
Oct 2, 2003
app pub date -
Mar 20, 2003
filing date -
Mar 27, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a circuit board comprising multiple layers and having an integrated circuit mounted on the outer layer thereof, a main power supply plane and a sub-power supply plane, which is disposed in an island fashion with a clearance that terminates electric connection with the main power supply plane, are formed on the same layer. The main power supply plane and the sub-power supply plane are connected by first power supply patterns that are formed on a layer different from the layer on which the power supply planes are formed and to which bypass condensers are connected. Power supply to some power supply terminals is achieved via second power supply patterns that are connected to the sub-power supply plane. The leakage of noise from the power supply terminals connected to the second power supply patterns is controlled by the first power supply patterns. Through this construction, the EMI noise radiated from the circuit board can be reduced while minimizing the number of bypass condensers.
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