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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
KYOCERA CORPORATION	6 TAKEDA TOBADONO-CHO FUSHIMI-KU KYOTO-SHI KYOTO 6128501 ?6128501

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hara, Shiro	Aichi, JP	32	324
Ito, Toshihide	Toyama, JP	54	255

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 09, 2004	US,6702176,B2   US6702176B2	GRANTED PATENT AS SECOND PUBLICATION
August 29, 2002	US,20020117539,A1   US20020117539A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 6702176

Solder, method for processing surface of printed wiring board, and method for mounting electronic part

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