Method and apparatus for monitoring polishing plate condition
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United States of America Patent
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Mar 9, 2004
Grant Date -
N/A
app pub date -
Jul 1, 2002
filing date -
Jul 1, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for monitoring a condition of a polishing plate, in particular for detecting the time for the polishing plate to be reconditioned or replaced, comprising a measuring unit containing at least one sensing unit and a signal-conditioning unit; and a data processing unit. The measuring unit is being in contact with the polishing plate and having a possibility to move relative to it. The sensing unit comprises a probing tip and a set of sensors attached to the back surface of the probing tip, and contains at least one sensor of the group of coefficient of friction sensor, acoustic emission sensor, wear sensor. All sensors work simultaneously and their measurement data is processed and analyzed by a data processing unit for obtaining accurate and reliable results.
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